Bluetooth v2.1/v4.0 (BLE) + EDR SMART SOC Class 1.5 3.3V 33-Pin SMD Tray

LSR would like to announce a low-cost and lowpower consumption module which has all of the Bluetooth functionalities. The highly integrated TiWi-uB2 module makes the use of Bluetooth headsets and other applications possible. The TiWi-uB2 module fully supports the dual mode Bluetooth and BLE operation, and the output power can support class 1.5. The SIP module provides UART interface / audio PCM interface for Bluetooth. The SIP module is specifically developed for Smart phones and Portable devices.

Bluetooth Class 1.5 33-Pin SMD Tray

RF TXRX MODULE BLUETOOTH

TiWi-uB2 Module

Bluetooth v2.1/v4.0 (BLE) + EDR SMART SOC Class 1.5 3.3V 33-Pin SMD Cut Tape

模块, TIWI-UB2, BLE 4.0

RF TXRX MODULE BLUETOOTH

Bluetooth v2.1/v4.0 (BLE) + EDR SMART SOC Class 1.5 3.3V 33-Pin SMD T/R

Built in CC2564 single-chip Bluetooth fully supports BT 2.1 + EDR, BLE 4.0. RF Output Power: +10 dBm (Class 1.5) RF Receive Sensitivity: -94 dBm Miniature Size: 7 mm x 7 mm x 1.5 mm Operating Voltage: 2.2V to 4.8V Operating temperature: -30 to +85o C Worldwide acceptance: FCC (USA), IC (Canada), and CE (Europe) RoHS compliant Supports maximum Bluetooth data rates over HCI UART interface. Supports multiple Bluetooth profiles with enhanced QoS, both mono and stereo, assisted A2DP

RF TXRX MODULE BLUETOOTH