Fabrication Technology | CMOS |
Configuration | 1 x 1:1 |
Maximum Quiescent Current (uA) | 3 |
Number of Elements per Chip | 4 |
Package Width (mm) | 3.99(Max) |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | QSOP |
Maximum High Level Output Current (mA) | -120 |
Absolute Propagation Delay Time (ns) | 5.4 |
印刷电路板已变更 | 16 |
Logic Function | Bus Switch |
Maximum Operating Supply Voltage (V) | 5.5 |
Package Height (mm) | 1.5(Max) |
Maximum On Resistance (Ohm) | 22(Typ) |
Number of Inputs per Chip | 4 |
Number of Outputs per Chip | 4 |
Standard Package Name | SOP |
Maximum Low Level Output Current (mA) | 120 |
Pin Count | 16 |
Mounting | Surface Mount |
欧盟限制某些有害物质的使用 | Compliant |
Package Length (mm) | 5(Max) |
Lead Shape | Gull-wing |
Packaging | Tape and Reel |
Typical Operating Supply Voltage (V) | 5 |
Minimum Operating Supply Voltage (V) | 4.5 |