| Configuration | Single |
| Typical Turn-Off Delay Time (ns) | 145 |
| Maximum Gate Source Leakage Current (nA) | 100 |
| Typical Rise Time (ns) | 510 |
| Channel Mode | Enhancement |
| Typical Turn-On Delay Time (ns) | 20 |
| Automotive | No |
| Supplier Package | D2PAK |
| Maximum IDSS (uA) | 1 |
| Channel Type | P |
| EU RoHS | Compliant with Exemption |
| Maximum Continuous Drain Current (A) | 17.2 |
| Maximum Pulsed Drain Current @ TC=25°C (A) | 90 |
| Maximum Drain Source Voltage (V) | 100 |
| Maximum Drain Source Resistance (mOhm) | 19@10V |
| Standard Package Name | TO-263 |
| Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 17.2 |
| Typical Reverse Recovery Charge (nC) | 220 |
| Pin Count | 3 |
| Mounting | Surface Mount |
| Minimum Gate Threshold Voltage (V) | 1 |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 1690@50V |
| Product Category | Power MOSFET |
| Typical Gate to Drain Charge (nC) | 51 |
| Typical Gate Charge @ Vgs (nC) | 217@10V|97@4.5V |
| Maximum Power Dissipation on PCB @ TC=25°C (W) | 13.6 |
| Typical Input Capacitance @ Vds (pF) | 11100@50V |
| PCB changed | 2 |
| HTS | 8541.29.00.95 |
| Typical Reverse Recovery Time (ns) | 80 |
| Number of Elements per Chip | 1 |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 13600 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 175 |
| Typical Fall Time (ns) | 870 |
| Process Technology | TrenchFET |
| Maximum Positive Gate Source Voltage (V) | 20 |
| Package Height | 4.83(Max) |
| Typical Gate to Source Charge (nC) | 42 |
| Military | No |
| Maximum Gate Source Voltage (V) | ±20 |
| Typical Gate Plateau Voltage (V) | 4.2 |
| Package Length | 10.41(Max) |
| Typical Gate Charge @ 10V (nC) | 217 |
| Maximum Diode Forward Voltage (V) | 1.5 |
| Typical Diode Forward Voltage (V) | 0.8 |
| Operating Junction Temperature (°C) | -55 to 175 |
| Typical Output Capacitance (pF) | 700 |
| Tab | Tab |
| Part Status | Active |
| Maximum Gate Threshold Voltage (V) | 3 |
| Package Width | 9.65(Max) |
| Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 40 |
