Typical Input Capacitance @ Vds (pF) | 665@10V |
Configuration | Dual Dual Drain |
Typical Turn-Off Delay Time (ns) | 29 |
PCB changed | 8 |
HTS | 8541.29.00.95 |
Number of Elements per Chip | 2 |
ECCN (US) | EAR99 |
Typical Rise Time (ns) | 50 |
Maximum Power Dissipation (mW) | 2000 |
Channel Mode | Enhancement |
Typical Turn-On Delay Time (ns) | 21 |
Automotive | No |
Minimum Operating Temperature (°C) | -50 |
Maximum Operating Temperature (°C) | 150 |
Supplier Package | SOIC N |
Typical Fall Time (ns) | 13 |
Process Technology | TrenchFET |
Typical Gate to Source Charge (nC) | 2.5 |
Package Height | 1.55(Max) |
Channel Type | P |
EU RoHS | Compliant |
Maximum Continuous Drain Current (A) | 4 |
Military | No |
Maximum Drain Source Voltage (V) | 20 |
Maximum Gate Source Voltage (V) | ±12 |
Maximum Drain Source Resistance (mOhm) | 58@4V |
Package Length | 5(Max) |
Typical Gate Charge @ 10V (nC) | 17 |
Standard Package Name | SOP |
Typical Reverse Recovery Charge (nC) | 10 |
Pin Count | 8 |
Mounting | Surface Mount |
Typical Output Capacitance (pF) | 220 |
Lead Shape | Gull-wing |
Part Status | Active |
Product Category | Power MOSFET |
Typical Gate to Drain Charge (nC) | 1.7 |
Packaging | Tape and Reel |
Maximum Gate Threshold Voltage (V) | 1.5 |
Package Width | 4(Max) |
Typical Gate Charge @ Vgs (nC) | 8@4.5V|17@10V |