Configuration | Dual |
Typical Turn-Off Delay Time (ns) | 12@P Channel|13@N Channel |
PCB changed | 6 |
HTS | 8541.29.00.95 |
Number of Elements per Chip | 2 |
ECCN (US) | EAR99 |
Typical Rise Time (ns) | 12@P Channel|9@N Channel |
Maximum Power Dissipation (mW) | 1150 |
Channel Mode | Enhancement |
Typical Turn-On Delay Time (ns) | 8@P Channel|7@N Channel |
Automotive | No |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 150 |
Supplier Package | TSOP |
Typical Fall Time (ns) | 7@P Channel|5@N Channel |
Process Technology | TrenchFET |
Package Height | 1(Max) |
Channel Type | P|N |
EU RoHS | Compliant |
Maximum Continuous Drain Current (A) | 2.5@N Channel|1.8@P Channel |
Military | No |
Maximum Drain Source Voltage (V) | 30 |
Maximum Gate Source Voltage (V) | ±20 |
Maximum Drain Source Resistance (mOhm) | 200@10V@P Channel|105@10V@N Channel |
Package Length | 3.05 |
Standard Package Name | SOP |
Pin Count | 6 |
Mounting | Surface Mount |
Lead Shape | Gull-wing |
Part Status | Active |
Product Category | Power MOSFET |
Packaging | Tape and Reel |
Package Width | 1.65 |
Typical Gate Charge @ Vgs (nC) | 2.4@5V@P Channel|2.1@5V@N Channel |