| Configuration | Single |
| Typical Turn-Off Delay Time (ns) | 71 |
| Maximum Gate Source Leakage Current (nA) | 100 |
| Typical Rise Time (ns) | 43 |
| Channel Mode | Enhancement |
| Typical Turn-On Delay Time (ns) | 25 |
| Automotive | No |
| Supplier Package | SOT-23 |
| Maximum IDSS (uA) | 1 |
| Channel Type | P |
| EU RoHS | Compliant |
| Maximum Continuous Drain Current (A) | 3.7 |
| Maximum Pulsed Drain Current @ TC=25°C (A) | 20 |
| Maximum Drain Source Voltage (V) | 20 |
| Maximum Drain Source Resistance (mOhm) | 39@4.5V |
| Standard Package Name | SOT-23 |
| Maximum Continuous Drain Current on PCB @ TC=25°C (A) | 4.7 |
| Pin Count | 3 |
| Mounting | Surface Mount |
| Minimum Gate Threshold Voltage (V) | 0.4 |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 140@10V |
| Lead Shape | Gull-wing |
| Product Category | Power MOSFET |
| Typical Gate to Drain Charge (nC) | 3.3 |
| Packaging | Tape and Reel |
| Typical Gate Charge @ Vgs (nC) | 12.5@4.5V |
| Typical Input Capacitance @ Vds (pF) | 1020@10V |
| Maximum Power Dissipation on PCB @ TC=25°C (W) | 1.25 |
| PCB changed | 3 |
| HTS | 8541.29.00.95 |
| Number of Elements per Chip | 1 |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 1250 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 150 |
| Typical Fall Time (ns) | 48 |
| Process Technology | TrenchFET |
| Typical Gate to Source Charge (nC) | 1.7 |
| Package Height | 1.02(Max) |
| Maximum Positive Gate Source Voltage (V) | 8 |
| Military | No |
| Maximum Gate Source Voltage (V) | ±8 |
| Typical Gate Plateau Voltage (V) | 1.5 |
| Package Length | 3.04(Max) |
| Maximum Diode Forward Voltage (V) | 1.2 |
| Typical Diode Forward Voltage (V) | 0.7 |
| Operating Junction Temperature (°C) | -55 to 150 |
| Typical Output Capacitance (pF) | 191 |
| Part Status | NRND |
| Maximum Gate Threshold Voltage (V) | 1 |
| Package Width | 1.4(Max) |
| Maximum Junction Ambient Thermal Resistance on PCB (°C/W) | 166 |
