| Number of Channels per Chip | 4 |
| Minimum Isolation Voltage (Vrms) | 5300 |
| PCB changed | 16 |
| HTS | 8541.40.80.00 |
| Output Type | DC |
| Maximum Collector-Emitter Voltage (V) | 20 |
| ECCN (US) | EAR99 |
| Current Transfer Ratio Test Current (mA) | 16 |
| Standard | CSA|FIMKO|UL|BSI |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 100 |
| Supplier Package | PDIP SMD |
| Maximum Collector-Emitter Saturation Voltage (mV) | 500 |
| Typical Forward Voltage (V) | 1.3 |
| Package Height | 3.81(Max) |
| EU RoHS | Compliant |
| Maximum Current Transfer Ratio (%) | 35(Typ) |
| Maximum Forward Current (mA) | 60 |
| Output Device | Transistor |
| Maximum Forward Voltage (V) | 1.5 |
| Input Type | DC |
| Package Length | 20.07(Max) |
| Standard Package Name | DIP |
| Pin Count | 16 |
| Mounting | Surface Mount |
| Minimum Current Transfer Ratio (%) | 12.5 |
| Lead Shape | Gull-wing |
| Part Status | Active |
| Packaging | Tube |
| Package Width | 6.81(Max) |
