Configuration | Dual |
Typical Turn-Off Delay Time (ns) | 22 |
PCB changed | 6 |
Maximum Gate Source Leakage Current (nA) | 10000 |
Number of Elements per Chip | 1 |
ECCN (US) | EAR99 |
Typical Rise Time (ns) | 32 |
Maximum Power Dissipation (mW) | 1900 |
Channel Mode | Enhancement |
Typical Turn-On Delay Time (ns) | 10 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 150 |
Supplier Package | PowerPAK SC-70 |
Maximum IDSS (uA) | 1 |
Typical Fall Time (ns) | 10 |
Process Technology | TrenchFET |
Package Height | 0.75(Max) |
Channel Type | N |
EU RoHS | Compliant |
Maximum Continuous Drain Current (A) | 4.5 |
Maximum Drain Source Voltage (V) | 20 |
Maximum Gate Source Voltage (V) | ±12 |
Maximum Drain Source Resistance (mOhm) | 34@4.5V |
Package Length | 2.05 |
Typical Gate Charge @ 10V (nC) | 11.3 |
Standard Package Name | SOT |
Pin Count | 6 |
Mounting | Surface Mount |
Part Status | Active |
Product Category | Power MOSFET |
Maximum Gate Threshold Voltage (V) | 1.3 |
Package Width | 2.05 |
Typical Gate Charge @ Vgs (nC) | 11.3@10V |