Number of Channels per Chip | 1 |
Minimum Isolation Voltage (Vrms) | 2500 |
PCB changed | 4 |
Output Type | DC |
Maximum Collector-Emitter Voltage (V) | 55 |
ECCN (US) | EAR99 |
Current Transfer Ratio Test Current (mA) | 5 |
Standard | UL |
Maximum Power Dissipation (mW) | 250 |
Typical Rise Time (us) | 2 |
Minimum Operating Temperature (°C) | -25 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | PDIP |
Maximum Collector-Emitter Saturation Voltage (mV) | 200(Typ) |
Typical Forward Voltage (V) | 1.15 |
Package Height | 3.65 |
Maximum Reverse Voltage (V) | 5 |
EU RoHS | Supplier Unconfirmed |
Maximum Current Transfer Ratio (%) | 600 |
Maximum Forward Current (mA) | 70 |
Output Device | Transistor |
Maximum Forward Voltage (V) | 1.3 |
Input Type | DC |
Minimum Forward Voltage (V) | 1 |
Maximum Collector Current (mA) | 50 |
Typical Fall Time (us) | 3 |
Package Length | 4.58 |
Standard Package Name | DIP |
Pin Count | 4 |
Mounting | Through Hole |
Minimum Current Transfer Ratio (%) | 100 |
Lead Shape | Through Hole |
Part Status | LTB |
Package Width | 6.4 |