Number of Channels per Chip | 4 |
Minimum Isolation Voltage (Vrms) | 2500 |
PCB changed | 16 |
Output Type | DC |
Maximum Collector-Emitter Voltage (V) | 80 |
ECCN (US) | EAR99 |
Current Transfer Ratio Test Current (mA) | 5 |
Standard | CSA|VDE|UL|DIN|EN|cUL |
Maximum Power Dissipation (mW) | 170 |
Typical Rise Time (us) | 2 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 110 |
Supplier Package | SO |
Maximum Collector-Emitter Saturation Voltage (mV) | 400 |
Typical Forward Voltage (V) | 1.2 |
Package Height | 2.1 |
Maximum Reverse Voltage (V) | 5 |
EU RoHS | Compliant |
Maximum Current Transfer Ratio (%) | 400 |
Maximum Forward Current (mA) | 50 |
Output Device | Transistor |
Maximum Forward Voltage (V) | 1.4 |
Input Type | DC |
Minimum Forward Voltage (V) | 1.1 |
Maximum Collector Current (mA) | 50 |
Typical Fall Time (us) | 3 |
Package Length | 10.3 |
Standard Package Name | SOP |
Pin Count | 16 |
Mounting | Surface Mount |
Minimum Current Transfer Ratio (%) | 50 |
Lead Shape | Gull-wing |
Part Status | Active |
Package Width | 4.55 |