Number of Channels per Chip | 1 |
Output Signal Type | Single |
Power Supply Type | Dual |
Configuration | Single 8:1 |
PCB changed | 16 |
HTS | 8542.39.00.01 |
ECCN (US) | EAR99 |
Maximum Turn-On Time (ns) | 150@2V |
Maximum Power Dissipation (mW) | 500 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | SOIC |
Maximum High Level Output Current (mA) | 25 |
Propagation Delay Test Condition (pF) | 50 |
Package Height | 1.38 |
EU RoHS | Compliant |
Maximum Dual Supply Voltage (V) | ±6 |
Maximum On Resistance (Ohm) | 240@4.5V |
Maximum Turn-Off Time (ns) | 90@2V |
Number of Inputs per Chip | 8 |
Maximum Propagation Delay Bus to Bus (ns) | 10@6V|25@2V|12@4.5V|8@±4.5V |
Maximum Frequency (25°C) @ Vcc (MHz) | 190(Typ)@±4.5V|200(Typ)@±6V|120(Typ)@±2.25V |
Number of Outputs per Chip | 1 |
Chip Enable Signals | Yes |
Package Length | 10.2(Max) |
Minimum Dual Supply Voltage (V) | 0|2 |
Standard Package Name | SOP |
Maximum Low Level Output Current (mA) | 25 |
Maximum On Resistance Range (Ohm) | 150 to 250 |
Pin Count | 16 |
Mounting | Surface Mount |
Type | Analog Multiplexer |
Input Signal Type | Single |
Typical Dual Supply Voltage (V) | ±3|±5 |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Tape and Reel |
Multiplexer Architecture | 8:1 |
Package Width | 3.9 |