Number of Channels per Chip | 16 |
Input Level | LVTTL |
Maximum Propagation Delay Time @ Maximum CL (ns) | 2.3(Typ)@3.3V |
PCB changed | 48 |
HTS | 8542.39.00.01 |
Output Type | 3-State |
Maximum Quiescent Current (uA) | 5000 |
Number of Elements per Chip | 2 |
ECCN (US) | EAR99 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | TSSOP |
Maximum High Level Output Current (mA) | -32 |
Process Technology | BiCMOS |
Absolute Propagation Delay Time (ns) | 5.5 |
Propagation Delay Test Condition (pF) | 50 |
Logic Function | Bus Transceiver |
Data Flow Direction | Bi-Directional |
Package Height | 1.05(Max) |
Polarity | Non-Inverting |
Maximum Operating Supply Voltage (V) | 3.6 |
EU RoHS | Compliant |
Number of Selection Inputs per Element | 0 |
Output Level | LVTTL |
Tolerant I/Os (V) | 5 |
Supplier Temperature Grade | Commercial |
Package Length | 12.6(Max) |
Standard Package Name | SOP |
Maximum Low Level Output Current (mA) | 64 |
Pin Count | 48 |
Mounting | Surface Mount |
Number of Output Enables per Element | 1 Low |
Number of Input Enables per Element | 0 |
Bus Hold | Yes |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Tape and Reel |
Logic Family | LVT |
Package Width | 6.2(Max) |
Number of Direction Control Inputs | 1 Low/High |
Minimum Operating Supply Voltage (V) | 2.7 |