Number of Channels per Chip | 16 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 4.9@2.7V|4.2@3.3V |
PCB changed | 48 |
HTS | 8542.39.00.01 |
Output Type | 3-State |
Maximum Quiescent Current (uA) | 20 |
Number of Elements per Chip | 2 |
ECCN (US) | EAR99 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
Supplier Package | TSSOP |
Maximum High Level Output Current (mA) | -24 |
Latch Mode | Transparent |
Process Technology | CMOS |
Absolute Propagation Delay Time (ns) | 6.3 |
Propagation Delay Test Condition (pF) | 50 |
Package Height | 1.05(Max) |
Polarity | Non-Inverting |
Maximum Operating Supply Voltage (V) | 3.6 |
EU RoHS | Compliant |
Number of Selection Inputs per Element | 0 |
Tolerant I/Os (V) | 5 |
Set/Reset | No |
Number of Inputs per Chip | 16 |
Number of Outputs per Chip | 16 |
Supplier Temperature Grade | Commercial |
Package Length | 12.6(Max) |
Standard Package Name | SOP |
Maximum Low Level Output Current (mA) | 24 |
Pin Count | 48 |
Mounting | Surface Mount |
Type | D-Type |
Number of Output Enables per Element | 1 |
Number of Input Enables per Element | 1 |
Bus Hold | Yes |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Tape and Reel |
Typical Operating Supply Voltage (V) | 3.3|2.5|1.8 |
Logic Family | LVC |
Package Width | 6.2(Max) |
Minimum Operating Supply Voltage (V) | 1.65 |