| Number of Channels per Chip | 2 |
| Number of Output Enables per Chip | 0 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 3.4@3.3V|2.9@5V |
| PCB changed | 6 |
| Output Type | Open Drain |
| Maximum Quiescent Current (uA) | 10 |
| Number of Elements per Chip | 2 |
| ECCN (US) | EAR99 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Package | DSBGA |
| Process Technology | CMOS |
| Absolute Propagation Delay Time (ns) | 7.2 |
| Propagation Delay Test Condition (pF) | 50 |
| Logic Function | Buffer/Driver |
| Package Height | 0.31(Max) |
| Polarity | Inverting |
| Maximum Operating Supply Voltage (V) | 5.5 |
| EU RoHS | Compliant |
| Tolerant I/Os (V) | 5 |
| Number of Inputs per Chip | 2 |
| Number of Outputs per Chip | 2 |
| Supplier Temperature Grade | Commercial |
| Package Length | 1.42(Max) |
| Standard Package Name | BGA |
| Maximum Low Level Output Current (mA) | 32 |
| Pin Count | 6 |
| Mounting | Surface Mount |
| Number of Input Enables per Chip | 0 |
| Input Signal Type | Single-Ended |
| Bus Hold | No |
| Lead Shape | Ball |
| Part Status | Active |
| Packaging | Tape and Reel |
| Typical Operating Supply Voltage (V) | 5|3.3|2.5|1.8 |
| Logic Family | LVC |
| Package Width | 0.92(Max) |
| Minimum Operating Supply Voltage (V) | 1.65 |
