Maximum Propagation Delay Time @ Maximum CL (ns) | 4.3@3.3V|3.3@5V |
PCB changed | 8 |
Output Type | Push-Pull |
Maximum Quiescent Current (uA) | 10 |
Number of Elements per Chip | 2 |
ECCN (US) | EAR99 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
Supplier Package | SSOP |
Maximum High Level Output Current (mA) | -32 |
Process Technology | CMOS |
Absolute Propagation Delay Time (ns) | 8.6 |
Propagation Delay Test Condition (pF) | 50 |
Logic Function | NAND |
Package Height | 1.2(Max) |
Number of Element Outputs | 1 |
Maximum Operating Supply Voltage (V) | 5.5 |
EU RoHS | Compliant |
Number of Selection Inputs per Element | 0 |
Number of Element Inputs | 2-IN |
Supplier Temperature Grade | Commercial |
Package Length | 3.15(Max) |
Standard Package Name | SOP |
Maximum Low Level Output Current (mA) | 32 |
Pin Count | 8 |
Mounting | Surface Mount |
Number of Output Enables per Element | 0 |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Tape and Reel |
Typical Operating Supply Voltage (V) | 5|3.3|2.5|1.8 |
Logic Family | LVC |
Package Width | 2.9(Max) |
Minimum Operating Supply Voltage (V) | 1.65 |