Number of Channels per Chip | 8 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 14.5@3.3V|18.7@2.5V|8.8@5V |
PCB changed | 20 |
HTS | 8542.39.00.01 |
Output Type | 3-State |
Maximum Quiescent Current (uA) | 20 |
Number of Elements per Chip | 1 |
ECCN (US) | EAR99 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | SOIC |
Maximum High Level Output Current (mA) | -16 |
Latch Mode | Transparent |
Process Technology | CMOS |
Absolute Propagation Delay Time (ns) | 23 |
Propagation Delay Test Condition (pF) | 50 |
Package Height | 2.35(Max) |
Polarity | Non-Inverting |
Maximum Operating Supply Voltage (V) | 5.5 |
EU RoHS | Compliant |
Number of Selection Inputs per Element | 0 |
Tolerant I/Os (V) | 5 Inputs |
Set/Reset | No |
Number of Inputs per Chip | 8 |
Number of Outputs per Chip | 8 |
Supplier Temperature Grade | Commercial |
Package Length | 13(Max) |
Standard Package Name | SOP |
Maximum Low Level Output Current (mA) | 16 |
Pin Count | 20 |
Mounting | Surface Mount |
Type | D-Type |
Number of Output Enables per Element | 1 |
Number of Input Enables per Element | 1 |
Bus Hold | No |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Tube |
Typical Operating Supply Voltage (V) | 5|3.3|2.5 |
Logic Family | LV |
Package Width | 7.6(Max) |
Minimum Operating Supply Voltage (V) | 2 |