Maximum Propagation Delay Time @ Maximum CL (ns) | 90@2V|15@6V|18@4.5V |
PCB changed | 14 |
HTS | 8542.39.00.01 |
Maximum Quiescent Current (uA) | 2 |
Number of Elements per Chip | 4 |
ECCN (US) | EAR99 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | SOIC |
Maximum High Level Output Current (mA) | -5.2 |
Process Technology | CMOS |
Absolute Propagation Delay Time (ns) | 115 |
Propagation Delay Test Condition (pF) | 50 |
Logic Function | NAND |
Package Height | 1.5(Max) |
Number of Element Outputs | 1 |
Maximum Operating Supply Voltage (V) | 6 |
EU RoHS | Compliant |
Number of Selection Inputs per Element | 0 |
Number of Element Inputs | 2-IN |
Package Length | 8.75(Max) |
Standard Package Name | SOP |
Maximum Low Level Output Current (mA) | 5.2 |
Pin Count | 14 |
Mounting | Surface Mount |
Number of Output Enables per Element | 0 |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Tape and Reel |
Typical Operating Supply Voltage (V) | 5 |
Logic Family | HC |
Package Width | 4(Max) |
Minimum Operating Supply Voltage (V) | 2 |