OMAPL138BZCE3 规格参数
| TMDSLCDK138 Texas Instruments KIT DEV OMAP-L138 Unit Price 195.59000 296-43006-ND | |
| Core Processor | ARM926EJ-S |
| Supplier Device Package | 361-NFBGA (13x13) |
| PCN Design/Specification | Hybrid Au/Cu Wire Bond Flow 08/Apr/2014 Multiple Changes Revision B 23/Jun/2014 |
| Package / Case | 361-LFBGA |
| Additional Interfaces | HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| Manufacturer | Texas Instruments |
| Design Resources | Development Tool Selector |
| Graphics Acceleration | No |
| PCN Obsolescence/ EOL | Freon/Netra/SubArtic EOL 06/Oct/2015 Freon/Netra/SubArtic EOL Update 4/Nov/2015 |