| Typical Input Capacitance @ Vds (pF) | 3150@12.5V |
| Configuration | Single Quad Drain Triple Source |
| Typical Turn-Off Delay Time (ns) | 20 |
| PCB changed | 8 |
| HTS | 8541.29.00.95 |
| Maximum Gate Source Leakage Current (nA) | 100 |
| Number of Elements per Chip | 1 |
| ECCN (US) | EAR99 |
| Typical Rise Time (ns) | 30 |
| Maximum Power Dissipation (mW) | 3100 |
| Channel Mode | Enhancement |
| Typical Turn-On Delay Time (ns) | 16.6 |
| Automotive | No |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 150 |
| Supplier Package | VSON-CLIP EP |
| Maximum IDSS (uA) | 1 |
| Typical Fall Time (ns) | 12.7 |
| Process Technology | NexFET |
| Package Height | 1.05(Max) |
| Channel Type | N |
| EU RoHS | Compliant with Exemption |
| Maximum Continuous Drain Current (A) | 100 |
| Military | No |
| Maximum Drain Source Voltage (V) | 25 |
| Maximum Gate Source Voltage (V) | 16 |
| Maximum Drain Source Resistance (mOhm) | 1.6@10V |
| Material | Si |
| Package Length | 5.1(Max) |
| Standard Package Name | SON |
| Pin Count | 8 |
| Mounting | Surface Mount |
| Lead Shape | No Lead |
| Part Status | Active |
| Product Category | Power MOSFET |
| Packaging | Tape and Reel |
| Maximum Gate Threshold Voltage (V) | 1.9 |
| Package Width | 6.1(Max) |
| Typical Gate Charge @ Vgs (nC) | 21@4.5V |
