Typical Input Capacitance @ Vds (pF) | 3150@12.5V |
Configuration | Single Quad Drain Triple Source |
Typical Turn-Off Delay Time (ns) | 20 |
PCB changed | 8 |
HTS | 8541.29.00.95 |
Number of Elements per Chip | 1 |
ECCN (US) | EAR99 |
Typical Rise Time (ns) | 30 |
Maximum Power Dissipation (mW) | 3100 |
Channel Mode | Enhancement |
Typical Turn-On Delay Time (ns) | 16.6 |
Automotive | No |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 150 |
Supplier Package | VSON-CLIP EP |
Typical Fall Time (ns) | 12.7 |
Process Technology | NexFET |
Typical Gate to Source Charge (nC) | 8.3 |
Package Height | 1.05(Max) |
Channel Type | N |
EU RoHS | Compliant with Exemption |
Maximum Continuous Drain Current (A) | 100 |
Military | No |
Maximum Drain Source Voltage (V) | 25 |
Maximum Gate Source Voltage (V) | 16 |
Maximum Drain Source Resistance (mOhm) | 1.6@10V |
Material | Si |
Package Length | 5.1(Max) |
Standard Package Name | SON |
Typical Reverse Recovery Charge (nC) | 72 |
Pin Count | 8 |
Mounting | Surface Mount |
Typical Output Capacitance (pF) | 2530 |
Lead Shape | No Lead |
Part Status | Active |
Product Category | Power MOSFET |
Typical Gate to Drain Charge (nC) | 5.2 |
Packaging | Tape and Reel |
Maximum Gate Threshold Voltage (V) | 1.9 |
Package Width | 6.1(Max) |
Typical Gate Charge @ Vgs (nC) | 21@4.5V |