Maximum Propagation Delay Time @ Maximum CL (ns) | 300@2V|60@4.5V|51@6V |
PCB changed | 16 |
HTS | 8542.39.00.01 |
Number of Elements per Chip | 1 |
ECCN (US) | EAR99 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 125 |
Supplier Package | SOIC |
Maximum High Level Output Current (mA) | -10 |
Process Technology | CMOS |
Absolute Propagation Delay Time (ns) | 450 |
Propagation Delay Test Condition (pF) | 50 |
Logic Function | Latch/Decoder/Driver |
Package Height | 1.5(Max) |
Number of Element Outputs | 7 |
Polarity | Non-Inverting |
Maximum Operating Supply Voltage (V) | 6 |
EU RoHS | Compliant |
Number of Element Inputs | 4 |
Supplier Temperature Grade | Military |
Package Length | 10(Max) |
Standard Package Name | SOP |
Maximum Low Level Output Current (mA) | 5.2 |
Pin Count | 16 |
Mounting | Surface Mount |
Number of Output Enables per Element | 0 |
Number of Input Enables per Element | 1 |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Tube |
Typical Operating Supply Voltage (V) | 5|3.3|2.5 |
Logic Family | HC |
Package Width | 4(Max) |
Maximum Quiescent Current (mA) | 0.008 |
Minimum Operating Supply Voltage (V) | 2 |