Number of Channels per Chip | 8 |
Input Level | TTL |
PCB changed | 20 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 19@4.5V to 5.5V |
HTS | 8542.39.00.01 |
Output Type | 3-State |
Number of Elements per Chip | 1 |
ECCN (US) | EAR99 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 125 |
Supplier Package | CFPAK |
Maximum High Level Output Current (mA) | -12 |
Process Technology | Bipolar |
Absolute Propagation Delay Time (ns) | 30 |
Propagation Delay Test Condition (pF) | 50 |
Logic Function | Bus Transceiver |
Data Flow Direction | Bi-Directional |
Package Height | 2.45(Max) |
Polarity | Non-Inverting |
Maximum Operating Supply Voltage (V) | 5.5 |
EU RoHS | Not Compliant |
Number of Selection Inputs per Element | 0 |
Output Level | TTL |
Package Length | 13.72(Max) |
Supplier Temperature Grade | Military |
Standard Package Name | FPAK |
Maximum Low Level Output Current (mA) | 12 |
Pin Count | 20 |
Mounting | Surface Mount |
Number of Output Enables per Element | 1 Low |
Number of Input Enables per Element | 0 |
Lead Shape | Flat |
Bus Hold | No |
Part Status | Active |
Packaging | Tube |
Package Width | 7.62(Max) |
Logic Family | ALS |
Number of Direction Control Inputs | 1 Low/High |
Minimum Operating Supply Voltage (V) | 4.5 |