Contact Mating Area Plating Material | Gold |
Circuit Application | Signal |
Connector & Contact Terminates To | Wire & Cable |
Contact Type | Socket |
Wire Range | 18 |
Contact Base Material | Phosphor Bronze |
Contact Color Bands | - |
Two Wire Insulation Diameter | - |
Termination Method to Wire & Cable | Solder |
Post Size | - |
Contact Retention in Housing | Crimp Snap-In |
Connector System | Cable-to-Cable |
Contact Current Rating (Max) | 3.1 |
TE Internal Number | 66569-2 |
Non-Magnetic | - |
Single Wire Insulation Diameter | - |
Pin Diameter | 1.02 |
Packaging Quantity | 10000 |
PCB Contact Termination Area Plating Material | Gold Flash |
High Current | - |
Socket Hood Plating Material | - |
Comment | - |
For Use With | AMPLIMITE HDP-20 |
Contact Style | Crimp Snap-in |
End Node Category | D-Sub Connector Contacts |
PCB Termination Area Plating Finish | - |
Operating Temperature Range | -67 – 221 |
Color Code | - |
Wire Insulation Support | Without |
Grade | Standard |
Insulation Diameter (Max) | - |
Socket Hood Finish | - |
Brand | AMP |
Solder Tail Contact Plating Thickness | - |
Contact Size | 20 |
Post Diameter | 2.16 |
Socket Hood Material | - |
Product Type | Contact |
Contact Underplating Material | Nickel |
Contact Mating Area Plating Thickness | 30 |
Packaging Method | Strip |
Termination Post Length | .37 |
Accepts Wire Insulation Diameter Range | - |