TE Connectivity

2:1 shrink ratio Low shrink temperature reduces installation time and the risk of damage to temperature-sensitive components Very flexible; doesn’t easily wrinkle when bent Highly flame-retardant Hot stamps extremely well Higher temperature rating, better thermal stability, and higher resistance to physical abuse than noncrosslinked materials Free of polybrominated biphenyls (PBBs) and polybrominated biphenyl oxides and ethers (PBBOs and PBBEs), which are classified as environmentally hazardous substances RoHS compliant