Contact Mating Area Plating Material | Palladium Nickel |
Industry Standard | - |
Circuit Application | Signal |
Housing Material | Matte |
Make First / Break Last | - |
Contact Type | Socket |
Number of Pairs | - |
Number of Power Positions | 4 |
Contact Base Material | Copper Alloy |
PCB Connector Assembly Type | PCB Mount Receptacle |
Number of Coax Positions | - |
PCB Contact Termination Area Plating Material | Tin |
Insulation Resistance | 2 |
Solder Tail Contact Plating Material Finish | Matte |
Connector Mounting Type | Board Mount |
Mating Pin-to-PCB Dimension | - |
Locating Post Length | - |
Sealant | - |
Number of Active Positions | - |
End Node Category | Board-to-Board Headers & Receptacles |
UL Flammability Rating | UL 94V-0 |
Dielectric Withstanding Voltage | 500 |
CSA File Number | 1195944 |
Mating Post Length | .064 |
Termination Post Length | - |
Impedance | 152 |
Contact Layout | Inline |
Solder Process Feature | - |
Tin to Lead Ratio | - |
Profile | - |
Agency/Standard | CSA |
Connector System | Board-to-Board |
TE Internal Number | 5767054-4 |
Cover Material | - |
Number of Contacts | - |
Housing Entry Style | Top |
Mating Alignment | With |
Width | .272 |
Sequencing | - |
Busbar Termination Area Plating Material | - |
Number of Positions | 152 |
Operating Temperature Range | -55 – 125 |
CSA Certified | Yes |
PCB Contact Termination Area Plating Thickness | 149.9997 – 249.9995 |
PCB Mount Retention | With |
Type | - |
Length | 2.498 |
PCB Retention Feature Plating Material | - |
Busbar Material | - |
Housing Color | - |
Underplate Material Thickness | - |
Post Styles | - |
Mating Retention | Without |
Post Numbers Omitted | - |
Row-to-Row Spacing | - |
Ground Contact Material | - |
Connector & Contact Terminates To | Printed Circuit Board |
Sealable | No |
Busbar Mating Area Plating Thickness | 500 |
Sealed Bottom | - |
Ground Component Type | - |
Packaging Reel Diameter | - |
Connector Contact Load Condition | - |
Boss | Yes |
Contact Current Rating (Max) | 11.5 |
Number of Center Guides | - |
Header Type | - |
Mating Alignment Type | Polarization |
PCB Thickness (Recommended) | .127 |
Contact Plating Thickness | - |
Packaging Quantity | 8 |
PCB Mount Alignment | With |
High Temperature Compatible | - |
Busbar Termination Area Plating Material Finish | - |
Tail Length | - |
Differential Signaling | Yes |
Pairs per Column | - |
Number of Signal Positions | 152 |
PCB Retention Feature Material | - |
Hybrid | - |
Sealing Method | - |
Contact Mating Area Plating Material Finish | Matte |
Brand | AMP |
Number of Columns | 76 |
UL Rating | Listed |
PCB Mount Orientation | Vertical |
Product Type | Connector |
Contact Mating Area Plating Thickness | .127 |
Connector Style | - |
Terminations per Post | - |
Contact Underplating Material | - |
Stackable | Yes |
PCB Mount Retention Type | Boardlock |
Stacking Configuration | - |
Number of Contacts Loaded | - |
Applied Pressure | - |
UL File Number | E28476 |
Board-to-Board Configuration | Mezzanine |
Number of Single Ended Lines | - |
Approved Standards | - |
Pick and Place Cover | Without |
Post Size | - |
PCB Hole Shape | - |
Data Rate | 10 |
Voltage | 4 |
Busbar Mating Area Plating Material | - |
Height | 5.99 |
Contact Resistance | - |
Comment | - |
Number of Rows | 2 |
Termination Resistance | - |
For Use With | Plug |
Centerline (Pitch) | .025 |
Termination Method to Printed Circuit Board | Surface Mount |
Hardware Type | - |
Contact Shape | - |
Assembly Process Feature | - |
Contact Configuration | Dual Beam |
Connector Seal Type | - |
PCB Mount Alignment Type | Locating Posts |
MIL-C-55032 | - |
Stack Height | 6.6 |
Stabilizers | - |
Packaging Method | Box & Tube |
Flame Retardant | - |
Keying Slot Location | - |