Contact Mating Area Plating Material | Gold or Gold Flash over Palladium Nickel |
Industry Standard | USB 2.0 |
Circuit Application | Power & Signal |
Housing Material | Thermoplastic |
Size | Standard |
Connector & Contact Terminates To | Printed Circuit Board |
Ground Component Type | M2 Threaded Hole |
Sealable | - |
Number of Mounting Legs | 2 |
Contact Current Rating (Max) | 1 |
Mating Cycles (Max) | 1500 |
Lock Device Color | - |
PCB Thickness (Recommended) | 1 |
Packaging Quantity | 350 |
Tail Length | .073 |
Connector Mounting Type | Board Mount |
Application Method | - |
End Node Category | USB Connectors |
UL Flammability Rating | UL 94V-0 |
Orientation | Right Angle |
Offset | 4 |
Brand | AMP |
Grounding Options | Panel Ground |
Product Type | Connector |
Contact Mating Area Plating Thickness | .76 |
Connector Style | Receptacle |
PCB Mount Retention Type | SMT Hold-Down |
Panel Mount Feature Type | Flange |
USB Version | 2 |
Termination Method | Solder |
Contact Termination Type | Surface Mount |
Connector System | Cable-to-Panel |
TE Internal Number | 5353928-1 |
Number of Ports | 1 |
Moisture Sensitivity Level | 1 |
Degree of Protection | - |
PCB Connector Seating | Offset |
Shell Plating Material | Tin |
Comment | - |
Number of Positions | 4 |
USB Type | A |
Panel Ground Location | Right/Left |
Pick & Place Capable | Yes |
Operating Temperature Range | -55 – 85 |
Pick and Place | Pick and Place Cover |
Centerline (Pitch) | .098 |
LED | Without |
Shell Plating Finish | Bright |
Termination Method to Printed Circuit Board | Reflow Solder |
Integral Locking Latch | - |
Locking Feature | With |
Locating Posts | With |
Halogen Free | No |
Housing Color | White |
Packaging Method | Tape & Reel |
Mounting Location | Top |
Soldering Temperature (Max) | 500 |
Test Identification (TID) | - |