| Contact Mating Area Plating Material | - | 
| Circuit Application | Signal | 
| Housing Material | Thermoplastic | 
| Connector & Contact Terminates To | Wire & Cable | 
| Contact Type | Socket | 
| Sealable | No | 
| Contact Base Material | - | 
| Contact Current Rating (Max) | - | 
| Panel Mount Feature | Without | 
| Wire/Cable Type | FFC | 
| Header Type | - | 
| Mating Alignment Type | Polarization | 
| PCB Thickness (Recommended) | - | 
| Packaging Quantity | 1000 | 
| PCB Contact Termination Area Plating Material | - | 
| Insulation Resistance | 5000 | 
| PCB Mount Alignment | - | 
| Tail Length | - | 
| Connector Mounting Type | Cable Mount | 
| Stamped | - | 
| End Node Category | FFC Connectors | 
| Color | Black | 
| UL Flammability Rating | UL 94V-0 | 
| Contact Termination Area Plating Material | - | 
| Contact Termination Area Plating Thickness | - | 
| Contact Mating Area Plating Material Finish | - | 
| Brand | AMP | 
| PCB Mount Orientation | - | 
| Mating Retention Type | - | 
| Product Type | Connector | 
| Mating Connector Lock | With | 
| Connector Style | Receptacle | 
| Contact Mating Area Plating Thickness | - | 
| Contact Underplating Material | - | 
| PCB Mount Retention Type | - | 
| Termination Post Length | - | 
| Panel Mount Feature Type | - | 
| Insertion Force | Normal | 
| Contact Layout | - | 
| Contact Termination Type | - | 
| Connector System | Wire-to-Board | 
| TE Internal Number | 487526-3 | 
| Voltage | 300 VAC | 
| Connector Type | Housing | 
| Mating Alignment | With | 
| Cable Entry | Straight | 
| Comment | - | 
| Number of Rows | 1 | 
| Number of Positions | 4 | 
| Type of Connector | Slimline | 
| Operating Temperature Range | -85 – 221 | 
| Centerline (Pitch) | .1 | 
| Dielectric Withstanding Voltage (Max) | 720 | 
| Mating Connector Lock Type | Latch | 
| Termination Method to Printed Circuit Board | - | 
| PCB Mount Retention | - | 
| Housing Color | Black | 
| Packaging Method | Carton | 
| Mating Retention | With | 
| Flame Retardant | Yes | 
| Row-to-Row Spacing | - |