| Number of Keys | 1 |
| Center Post | - |
| Contact Mating Area Plating Material | Gold Flash |
| Circuit Application | Signal |
| Housing Material | High Temperature Thermoplastic |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sealable | No |
| Contact Base Material | Copper Alloy |
| Contact Current Rating (Max) | .3 |
| Boss | - |
| DRAM Type | - |
| Mating Alignment Type | Polarization |
| Packaging Quantity | 20 |
| PCB Contact Termination Area Plating Material | Gold Flash |
| Boardlock Plating Material Finish | - |
| Boardlock Material | - |
| Solder Tail Contact Plating Material Finish | - |
| End Node Category | Mini PCI Express & mSATA |
| PCB Mounting Style | Surface Mount |
| UL Flammability Rating | UL 94V-0 |
| High Temperature Housing | Yes |
| Brand | AMP |
| Insertion Style | Cam-In |
| PCB Mount Orientation | Right Angle |
| Product Type | Connector |
| Contact Underplating Material | Nickel |
| Contact Mating Area Plating Thickness | .25 |
| Connector Style | Receptacle |
| Stackable | No |
| PCB Mount Retention Type | - |
| Latch Material | Brass |
| Module Orientation | Right Angle |
| Boardlock Plating Material | Tin |
| Latch Plating Material | Tin |
| Boardlock Type | - |
| Ejector Location | None |
| Connector System | Board-to-Board |
| TE Internal Number | 440360-2 |
| Comment | Tray is transparent. |
| Number of Rows | 2 |
| DRAM Voltage | - |
| Number of Positions | 124 |
| Operating Temperature Range | -67 – 185 |
| Center Key | - |
| Height Above PC Board | .31 |
| Centerline (Pitch) | .8 |
| PCB Mount Retention | Without |
| Bus Type | Mini PCI |
| Ejector Type | - |
| Stack Height | 7.95 |
| Housing Color | Black |
| Packaging Method | Tray |
| Row-to-Row Spacing | - |
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