Keying | - |
Number of Keys | - |
Center Post | - |
Contact Mating Area Plating Material | - |
Polarization | Left |
Socket Type | - |
Circuit Application | Signal |
Mounting Angle | - |
Housing Material | - |
Connector & Contact Terminates To | Printed Circuit Board |
Sealable | No |
Contact Base Material | - |
Latch Color | - |
Module Key Type | - |
Contact Current Rating (Max) | .75 |
DRAM Type | Double Data Rate (DDR) 3 |
Socket Style | - |
Packaging Quantity | - |
PCB Contact Termination Area Plating Material | - |
Boardlock Material | - |
Connector Mounting Type | Board Mount |
End Node Category | DIMM Sockets |
PCB Mounting Style | Through Hole |
UL Flammability Rating | - |
Number of Bays | - |
Retention Post Location | - |
Brand | TE Connectivity |
Solder Tail Contact Plating Thickness | - |
Insertion Style | - |
Product Type | Socket |
Contact Underplating Material | - |
Contact Mating Area Plating Thickness | - |
Center Retention Hole Diameter | - |
PCB Mount Retention Type | Boardlock |
Termination Post Length | - |
Latch Material | - |
Module Orientation | Vertical |
Retention Post Material | - |
Latch Plating Material | - |
Ejector Location | - |
Profile | - |
Connector System | Board-to-Board |
TE Internal Number | 4-1932000-7 |
Comment | - |
Number of Rows | - |
DRAM Voltage | - |
Number of Positions | 240 |
Operating Temperature Range | -55 – 155 |
Center Key | - |
Height Above PC Board | - |
Centerline (Pitch) | .039 |
PCB Mount Retention | - |
Ejector Type | Standard |
Locating Posts | - |
Ejector Material Color | - |
Housing Color | - |
Stack Height | - |
Packaging Method | Tray |
Ejector Material | - |
Row-to-Row Spacing | .075 |