| Keying | - |
| Number of Keys | - |
| Center Post | - |
| Contact Mating Area Plating Material | - |
| Polarization | Left |
| Socket Type | - |
| Circuit Application | Signal |
| Mounting Angle | - |
| Housing Material | - |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sealable | No |
| Contact Base Material | - |
| Latch Color | - |
| Module Key Type | - |
| Contact Current Rating (Max) | .75 |
| DRAM Type | Double Data Rate (DDR) 3 |
| Socket Style | - |
| Packaging Quantity | - |
| PCB Contact Termination Area Plating Material | - |
| Boardlock Material | - |
| Connector Mounting Type | Board Mount |
| End Node Category | DIMM Sockets |
| PCB Mounting Style | Through Hole |
| UL Flammability Rating | - |
| Number of Bays | - |
| Retention Post Location | - |
| Brand | TE Connectivity |
| Solder Tail Contact Plating Thickness | - |
| Insertion Style | - |
| Product Type | Socket |
| Contact Underplating Material | - |
| Contact Mating Area Plating Thickness | - |
| Center Retention Hole Diameter | - |
| PCB Mount Retention Type | Boardlock |
| Termination Post Length | - |
| Latch Material | - |
| Module Orientation | Vertical |
| Retention Post Material | - |
| Latch Plating Material | - |
| Ejector Location | - |
| Profile | - |
| Connector System | Board-to-Board |
| TE Internal Number | 4-1932000-7 |
| Comment | - |
| Number of Rows | - |
| DRAM Voltage | - |
| Number of Positions | 240 |
| Operating Temperature Range | -55 – 155 |
| Center Key | - |
| Height Above PC Board | - |
| Centerline (Pitch) | .039 |
| PCB Mount Retention | - |
| Ejector Type | Standard |
| Locating Posts | - |
| Ejector Material Color | - |
| Housing Color | - |
| Stack Height | - |
| Packaging Method | Tray |
| Ejector Material | - |
| Row-to-Row Spacing | .075 |
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