| Contact Mating Area Plating Material | Gold |
| Industry Standard | - |
| Circuit Application | Power & Signal |
| Housing Material | LCP (Liquid Crystal Polymer) |
| Make First / Break Last | - |
| Contact Type | Hermaphroditic |
| Number of Pairs | - |
| Number of Power Positions | - |
| Contact Base Material | Copper Alloy |
| PCB Connector Assembly Type | PCB Mount Hermaphroditic Connector |
| Number of Coax Positions | - |
| PCB Contact Termination Area Plating Material | Tin |
| Insulation Resistance | - |
| Solder Tail Contact Plating Material Finish | - |
| Connector Mounting Type | Board Mount |
| Mating Pin-to-PCB Dimension | - |
| Locating Post Length | - |
| Sealant | - |
| Number of Active Positions | - |
| End Node Category | Board-to-Board Headers & Receptacles |
| UL Flammability Rating | UL 94V-0 |
| Dielectric Withstanding Voltage | - |
| CSA File Number | - |
| Mating Post Length | .173 |
| Termination Post Length | - |
| Impedance | - |
| Contact Layout | - |
| Solder Process Feature | - |
| Tin to Lead Ratio | - |
| Profile | - |
| Agency/Standard | - |
| Connector System | Board-to-Board |
| TE Internal Number | 316918-1 |
| Cover Material | - |
| Number of Contacts | - |
| Housing Entry Style | Top |
| Mating Alignment | With |
| Width | - |
| Sequencing | - |
| Busbar Termination Area Plating Material | - |
| Number of Positions | 240 |
| Operating Temperature Range | -55 – 85 |
| CSA Certified | - |
| PCB Contact Termination Area Plating Thickness | 2 |
| PCB Mount Retention | With |
| Type | - |
| Length | - |
| PCB Retention Feature Plating Material | - |
| Busbar Material | - |
| Housing Color | - |
| Underplate Material Thickness | - |
| Post Styles | - |
| Mating Retention | - |
| Post Numbers Omitted | - |
| Row-to-Row Spacing | - |
| Ground Contact Material | - |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sealable | No |
| Busbar Mating Area Plating Thickness | - |
| Sealed Bottom | - |
| Ground Component Type | - |
| Packaging Reel Diameter | - |
| Connector Contact Load Condition | - |
| Boss | Yes |
| Contact Current Rating (Max) | .5 |
| Number of Center Guides | - |
| Header Type | - |
| Mating Alignment Type | Polarization |
| PCB Thickness (Recommended) | 1.6 |
| Contact Plating Thickness | - |
| Packaging Quantity | 720 |
| PCB Mount Alignment | With |
| High Temperature Compatible | - |
| Busbar Termination Area Plating Material Finish | - |
| Tail Length | - |
| Differential Signaling | - |
| Pairs per Column | - |
| Number of Signal Positions | - |
| PCB Retention Feature Material | - |
| Hybrid | - |
| Sealing Method | - |
| Contact Mating Area Plating Material Finish | - |
| Brand | TE Connectivity |
| Number of Columns | - |
| UL Rating | - |
| PCB Mount Orientation | - |
| Product Type | Connector |
| Contact Mating Area Plating Thickness | 19.7 |
| Connector Style | - |
| Terminations per Post | - |
| Contact Underplating Material | - |
| Stackable | Yes |
| PCB Mount Retention Type | Solder Peg |
| Stacking Configuration | - |
| Number of Contacts Loaded | - |
| Applied Pressure | - |
| UL File Number | - |
| Board-to-Board Configuration | Stacking |
| Number of Single Ended Lines | - |
| Approved Standards | - |
| Pick and Place Cover | - |
| Post Size | - |
| PCB Hole Shape | - |
| Data Rate | - |
| Voltage | - |
| Busbar Mating Area Plating Material | - |
| Height | .35 |
| Contact Resistance | - |
| Comment | - |
| Number of Rows | 1 |
| Termination Resistance | - |
| For Use With | - |
| Centerline (Pitch) | .6 |
| Termination Method to Printed Circuit Board | Through Hole - Solder |
| Hardware Type | - |
| Contact Shape | Rectangle |
| Assembly Process Feature | - |
| Contact Configuration | - |
| Connector Seal Type | - |
| PCB Mount Alignment Type | Boss |
| MIL-C-55032 | - |
| Stack Height | 4 |
| Stabilizers | - |
| Packaging Method | Tray |
| Flame Retardant | - |
| Keying Slot Location | - |
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