| Number of Keys | 1 |
| Keying | - |
| Center Post | - |
| Contact Mating Area Plating Material | Gold |
| Socket Type | Memory Card |
| Circuit Application | Signal |
| SGRAM Voltage | - |
| Housing Material | High Temperature Plastic |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sealable | No |
| Contact Base Material | Copper Alloy |
| Module Key Type | SDRAM |
| Contact Current Rating (Max) | - |
| DRAM Type | Small Outline (SO) |
| Socket Style | SO DIMM |
| Packaging Quantity | 12 |
| PCB Contact Termination Area Plating Material | Gold Flash |
| Connector Mounting Type | Board Mount |
| End Node Category | SO DIMM Sockets |
| PCB Mounting Style | Surface Mount |
| UL Flammability Rating | UL 94V-0 |
| Number of Bays | 2 |
| Retention Post Location | - |
| Brand | AMP |
| Insertion Style | Cam-In |
| Product Type | Socket |
| Contact Mating Area Plating Thickness | .25 |
| Contact Underplating Material | - |
| PCB Mount Retention Type | Hold-Down Post |
| Latch Material | Stainless Steel |
| SGRAM Type | - |
| Module Orientation | Right Angle |
| Retention Post Material | - |
| Latch Plating Material | Tin |
| Ejector Location | None |
| Profile | Standard |
| Connector System | Cable-to-Board |
| TE Internal Number | 3-390113-1 |
| Comment | - |
| Number of Rows | 2 |
| DRAM Voltage | 3.3 |
| Number of Positions | 144 |
| Operating Temperature Range | -67 – 221 |
| Center Key | Offset Left |
| Centerline (Pitch) | .8 |
| PCB Mount Retention | With |
| Ejector Type | - |
| Stack Height | .205 |
| Housing Color | Natural |
| Packaging Method | JEDEC Hard Tray |
| Row-to-Row Spacing | .244 |
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