Contact Mating Area Plating Material | Gold |
Industry Standard | - |
Circuit Application | Signal |
Housing Material | LCP (Liquid Crystal Polymer) |
Make First / Break Last | - |
Contact Type | Socket |
Number of Pairs | - |
Number of Power Positions | - |
Contact Base Material | Phosphor Bronze |
PCB Connector Assembly Type | PCB Mount Receptacle |
Number of Coax Positions | - |
PCB Contact Termination Area Plating Material | Tin-Lead |
Insulation Resistance | 5 |
Solder Tail Contact Plating Material Finish | - |
Connector Mounting Type | Board Mount |
Mating Pin-to-PCB Dimension | - |
Locating Post Length | - |
Sealant | - |
Number of Active Positions | - |
End Node Category | Board-to-Board Headers & Receptacles |
UL Flammability Rating | - |
Dielectric Withstanding Voltage | - |
CSA File Number | - |
Mating Post Length | - |
Termination Post Length | 3.56 |
Impedance | 30 |
Contact Layout | Matrix |
Solder Process Feature | - |
Tin to Lead Ratio | - |
Profile | - |
Agency/Standard | - |
Connector System | Board-to-Board |
TE Internal Number | 223008-1 |
Cover Material | - |
Number of Contacts | - |
Housing Entry Style | - |
Mating Alignment | With |
Width | - |
Sequencing | No |
Busbar Termination Area Plating Material | - |
Number of Positions | 30 |
Operating Temperature Range | -55 – 125 |
CSA Certified | - |
PCB Contact Termination Area Plating Thickness | 23.62 |
PCB Mount Retention | Without |
Type | - |
Length | - |
PCB Retention Feature Plating Material | - |
Busbar Material | - |
Housing Color | Natural |
Underplate Material Thickness | - |
Post Styles | - |
Mating Retention | - |
Post Numbers Omitted | - |
Row-to-Row Spacing | - |
Ground Contact Material | - |
Connector & Contact Terminates To | Printed Circuit Board |
Sealable | No |
Busbar Mating Area Plating Thickness | - |
Sealed Bottom | - |
Ground Component Type | - |
Packaging Reel Diameter | - |
Connector Contact Load Condition | - |
Boss | - |
Contact Current Rating (Max) | 4.5 |
Number of Center Guides | - |
Header Type | - |
Mating Alignment Type | Polarization |
PCB Thickness (Recommended) | - |
Contact Plating Thickness | - |
Packaging Quantity | 48 |
PCB Mount Alignment | With |
High Temperature Compatible | - |
Busbar Termination Area Plating Material Finish | - |
Tail Length | .137 |
Differential Signaling | - |
Pairs per Column | - |
Number of Signal Positions | 30 |
PCB Retention Feature Material | - |
Hybrid | - |
Sealing Method | - |
Contact Mating Area Plating Material Finish | - |
Brand | AMP |
Number of Columns | - |
UL Rating | - |
PCB Mount Orientation | Right Angle |
Product Type | Connector |
Contact Mating Area Plating Thickness | 30 |
Connector Style | - |
Terminations per Post | - |
Contact Underplating Material | - |
Stackable | - |
PCB Mount Retention Type | - |
Stacking Configuration | - |
Number of Contacts Loaded | - |
Applied Pressure | - |
UL File Number | - |
Board-to-Board Configuration | Right Angle |
Number of Single Ended Lines | - |
Approved Standards | - |
Pick and Place Cover | Without |
Post Size | - |
PCB Hole Shape | - |
Data Rate | - |
Voltage | 30 |
Busbar Mating Area Plating Material | - |
Height | 11.3 |
Contact Resistance | - |
Comment | - |
Number of Rows | 5 |
Termination Resistance | - |
For Use With | - |
Centerline (Pitch) | .079 |
Termination Method to Printed Circuit Board | Through Hole - Press-Fit |
Hardware Type | - |
Contact Shape | - |
Assembly Process Feature | - |
Contact Configuration | Signal |
Connector Seal Type | - |
PCB Mount Alignment Type | Locating Posts |
MIL-C-55032 | - |
Stack Height | - |
Stabilizers | Press-Fit |
Packaging Method | Tube |
Flame Retardant | - |
Keying Slot Location | - |