| Contact Mating Area Plating Material | Gold |
| Industry Standard | - |
| Circuit Application | Signal |
| Housing Material | LCP (Liquid Crystal Polymer) |
| Make First / Break Last | - |
| Contact Type | Socket |
| Number of Pairs | - |
| Number of Power Positions | - |
| Contact Base Material | Phosphor Bronze |
| PCB Connector Assembly Type | PCB Mount Receptacle |
| Number of Coax Positions | - |
| PCB Contact Termination Area Plating Material | Tin-Lead |
| Insulation Resistance | 5 |
| Solder Tail Contact Plating Material Finish | - |
| Connector Mounting Type | Board Mount |
| Mating Pin-to-PCB Dimension | - |
| Locating Post Length | - |
| Sealant | - |
| Number of Active Positions | - |
| End Node Category | Board-to-Board Headers & Receptacles |
| UL Flammability Rating | - |
| Dielectric Withstanding Voltage | - |
| CSA File Number | - |
| Mating Post Length | - |
| Termination Post Length | 3.53 |
| Impedance | 60 |
| Contact Layout | Matrix |
| Solder Process Feature | - |
| Tin to Lead Ratio | - |
| Profile | - |
| Agency/Standard | - |
| Connector System | Board-to-Board |
| TE Internal Number | 223007-2 |
| Cover Material | - |
| Number of Contacts | - |
| Housing Entry Style | - |
| Mating Alignment | With |
| Width | - |
| Sequencing | No |
| Busbar Termination Area Plating Material | - |
| Number of Positions | 60 |
| Operating Temperature Range | -67 – 257 |
| CSA Certified | - |
| PCB Contact Termination Area Plating Thickness | 150 |
| PCB Mount Retention | Without |
| Type | - |
| Length | - |
| PCB Retention Feature Plating Material | - |
| Busbar Material | - |
| Housing Color | - |
| Underplate Material Thickness | - |
| Post Styles | - |
| Mating Retention | - |
| Post Numbers Omitted | - |
| Row-to-Row Spacing | 2 |
| Ground Contact Material | - |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sealable | No |
| Busbar Mating Area Plating Thickness | - |
| Sealed Bottom | - |
| Ground Component Type | - |
| Packaging Reel Diameter | - |
| Connector Contact Load Condition | - |
| Boss | - |
| Contact Current Rating (Max) | 4.5 |
| Number of Center Guides | - |
| Header Type | - |
| Mating Alignment Type | Polarization |
| PCB Thickness (Recommended) | .76 |
| Contact Plating Thickness | - |
| Packaging Quantity | 24 |
| PCB Mount Alignment | With |
| High Temperature Compatible | - |
| Busbar Termination Area Plating Material Finish | - |
| Tail Length | .13 |
| Differential Signaling | - |
| Pairs per Column | - |
| Number of Signal Positions | 60 |
| PCB Retention Feature Material | - |
| Hybrid | - |
| Sealing Method | - |
| Contact Mating Area Plating Material Finish | - |
| Brand | AMP |
| Number of Columns | - |
| UL Rating | - |
| PCB Mount Orientation | Right Angle |
| Product Type | Connector |
| Contact Mating Area Plating Thickness | 30 |
| Connector Style | - |
| Terminations per Post | - |
| Contact Underplating Material | - |
| Stackable | - |
| PCB Mount Retention Type | - |
| Stacking Configuration | - |
| Number of Contacts Loaded | - |
| Applied Pressure | - |
| UL File Number | - |
| Board-to-Board Configuration | Right Angle |
| Number of Single Ended Lines | - |
| Approved Standards | - |
| Pick and Place Cover | Without |
| Post Size | - |
| PCB Hole Shape | - |
| Data Rate | - |
| Voltage | 30 |
| Busbar Mating Area Plating Material | - |
| Height | 11.3 |
| Contact Resistance | - |
| Comment | - |
| Number of Rows | 5 |
| Termination Resistance | - |
| For Use With | - |
| Centerline (Pitch) | 2 |
| Termination Method to Printed Circuit Board | Through Hole |
| Hardware Type | - |
| Contact Shape | - |
| Assembly Process Feature | - |
| Contact Configuration | Signal |
| Connector Seal Type | - |
| PCB Mount Alignment Type | Locating Posts |
| MIL-C-55032 | - |
| Stack Height | - |
| Stabilizers | Solder Post |
| Packaging Method | Tube |
| Flame Retardant | - |
| Keying Slot Location | - |
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