Contact Mating Area Plating Material | Gold |
Industry Standard | USB 2.0 |
Circuit Application | Power & Signal |
Housing Material | Thermoplastic |
Size | Micro |
Connector & Contact Terminates To | Printed Circuit Board |
Ground Component Type | - |
Sealable | - |
Number of Mounting Legs | - |
Contact Current Rating (Max) | 1.8 |
Mating Cycles (Max) | 10000 |
Lock Device Color | - |
PCB Thickness (Recommended) | .8 – 1. |
Packaging Quantity | 1000 |
Tail Length | .85 |
Connector Mounting Type | Board Mount |
Application Method | - |
End Node Category | USB Connectors |
UL Flammability Rating | UL 94V-0 |
Orientation | Right Angle |
Offset | .8 |
Brand | TE Connectivity |
Grounding Options | - |
Product Type | Connector |
Contact Mating Area Plating Thickness | .76 |
Connector Style | Receptacle |
PCB Mount Retention Type | SMT Hold-Down |
Panel Mount Feature Type | Flange |
USB Version | 2 |
Termination Method | Surface Mount |
Contact Termination Type | Surface Mount |
Connector System | Cable-to-Board |
TE Internal Number | 2173157-3 |
Number of Ports | 1 |
Moisture Sensitivity Level | 1 |
Degree of Protection | Splashproof |
PCB Connector Seating | Offset |
Shell Plating Material | Tin over Nickel |
Comment | - |
Number of Positions | 5 |
USB Type | B |
Panel Ground Location | - |
Pick & Place Capable | Yes |
Operating Temperature Range | -22 – 185 |
Pick and Place | Without Pick and Place Cover |
Centerline (Pitch) | .025 |
LED | Without |
Shell Plating Finish | Matte |
Termination Method to Printed Circuit Board | Reflow Solder |
Integral Locking Latch | Without |
Locking Feature | Without |
Locating Posts | Without |
Halogen Free | No |
Housing Color | Black |
Packaging Method | Tape & Reel |
Mounting Location | Top |
Soldering Temperature (Max) | 260 |
Test Identification (TID) | - |