| Contact Mating Area Plating Material | Gold or Gold Flash over Palladium Nickel |
| Circuit Application | Power & Signal |
| Heat Sink Style | - |
| Heat Sink Finish | - |
| Connector & Contact Terminates To | Printed Circuit Board |
| Integrated Lightpipes | - |
| Sealable | No |
| Form Factor | zSFP+(SFP28/56) |
| Connector System | Cable-to-Board |
| Contact Current Rating (Max) | .5 |
| TE Internal Number | 2170088-1 |
| Number of Ports | - |
| Pluggable I/O Applications | SFP+ |
| PCB Thickness (Recommended) | - |
| Data Rate (Max) | 32 |
| Cage Material | - |
| Included Heat Sink | No |
| Lightpipe Style | - |
| Lightpipe Profile | - |
| PCB Contact Termination Area Plating Material | - |
| Connector Mounting Type | Board Mount |
| Tail Length | - |
| Tail Plating Material | - |
| Heat Sink Height | - |
| Comment | - |
| Heat Sink Height Class | - |
| 插拔式 I/O 附件类型 | - |
| Number of Positions | 20 |
| Lightpipe Configuration | - |
| End Node Category | SFP/SFP+/zSFP+ |
| PCB Mounting Style | Surface Mount |
| Operating Temperature Range | -55 – 85 |
| UL Flammability Rating | UL 94V-0 |
| Centerline (Pitch) | .031 |
| Termination Method to Printed Circuit Board | Surface Mount |
| For Use With Pluggable I/O Products | zSFP+ SMT Connector |
| Brand | TE Connectivity |
| Included Lightpipe | - |
| Product Type | Connector |
| Contact Mating Area Plating Thickness | - |
| Contact Underplating Material | - |
| Packaging Method | Reel |
| Port Matrix Configuration | - |
| Heat Sink Compatible | - |
| EMI Containment Feature Type | - |
| Cage Type | - |
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