| Contact Mating Area Plating Material | Gold |
| Circuit Application | Signal |
| Heat Sink Finish | - |
| Heat Sink Style | - |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sealable | No |
| Connector System | Cable-to-Board |
| Form Factor | QSFP+ |
| Contact Current Rating (Max) | .5 |
| TE Internal Number | 2110819-1 |
| Number of Ports | - |
| Pluggable I/O Applications | - |
| PCB Thickness (Recommended) | .057 |
| Data Rate (Max) | 28 |
| Cage Material | - |
| Included Heat Sink | - |
| Rear EONs per Port Column | - |
| PCB Contact Termination Area Plating Material | Tin |
| Tail Length | - |
| Connector Mounting Type | Board Mount |
| Heat Sink Height | - |
| Heat Sink Height Class | - |
| Lightpipe Configuration | - |
| 插拔式 I/O 附件类型 | - |
| Number of Positions | 38 |
| End Node Category | QSFP/QSFP+/zQSFP+ |
| Operating Temperature Range | -67 – 221 |
| UL Flammability Rating | UL 94V-0 |
| Centerline (Pitch) | .8 |
| Termination Method to Printed Circuit Board | Surface Mount |
| For Use With Pluggable I/O Products | QSFP+ Cage |
| Brand | TE Connectivity |
| Included Lightpipe | - |
| Product Type | Connector |
| Contact Mating Area Plating Thickness | 30 |
| Contact Underplating Material | - |
| Packaging Method | Reel |
| Enhancements | - |
| Port Matrix Configuration | - |
| EMI Containment Feature Type | - |
| Cage Type | - |
| Heat Sink Compatible | - |
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