| Contact Mating Area Plating Material | Gold over Nickel |
| Industry Standard | - |
| Circuit Application | - |
| Housing Material | LCP (Liquid Crystal Polymer) |
| Make First / Break Last | - |
| Contact Type | Socket |
| Number of Pairs | - |
| Number of Power Positions | - |
| Contact Base Material | Beryllium Copper |
| PCB Connector Assembly Type | PCB Mount Receptacle |
| Number of Coax Positions | - |
| PCB Contact Termination Area Plating Material | Tin-Lead |
| Insulation Resistance | - |
| Solder Tail Contact Plating Material Finish | - |
| Connector Mounting Type | - |
| Mating Pin-to-PCB Dimension | - |
| Locating Post Length | - |
| Sealant | - |
| Number of Active Positions | - |
| End Node Category | Board-to-Board Headers & Receptacles |
| UL Flammability Rating | - |
| Dielectric Withstanding Voltage | 750 |
| CSA File Number | - |
| Mating Post Length | - |
| Termination Post Length | - |
| Impedance | - |
| Contact Layout | Matrix |
| Solder Process Feature | - |
| Tin to Lead Ratio | - |
| Profile | - |
| Agency/Standard | - |
| Connector System | Board-to-Board |
| TE Internal Number | 2102430-1 |
| Cover Material | - |
| Number of Contacts | - |
| Housing Entry Style | - |
| Mating Alignment | With |
| Width | - |
| Sequencing | - |
| Busbar Termination Area Plating Material | - |
| Number of Positions | 320 |
| Operating Temperature Range | -55 – 125 |
| CSA Certified | - |
| PCB Contact Termination Area Plating Thickness | - |
| PCB Mount Retention | Without |
| Type | - |
| Length | - |
| PCB Retention Feature Plating Material | - |
| Busbar Material | - |
| Housing Color | Natural |
| Underplate Material Thickness | - |
| Post Styles | - |
| Mating Retention | - |
| Post Numbers Omitted | - |
| Row-to-Row Spacing | .05 |
| Ground Contact Material | - |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sealable | No |
| Busbar Mating Area Plating Thickness | - |
| Sealed Bottom | - |
| Ground Component Type | - |
| Packaging Reel Diameter | - |
| Connector Contact Load Condition | - |
| Boss | - |
| Contact Current Rating (Max) | 1.5 |
| Number of Center Guides | - |
| Header Type | - |
| Mating Alignment Type | Polarizing Rib |
| PCB Thickness (Recommended) | - |
| Contact Plating Thickness | - |
| Packaging Quantity | - |
| PCB Mount Alignment | Without |
| High Temperature Compatible | - |
| Busbar Termination Area Plating Material Finish | - |
| Tail Length | - |
| Differential Signaling | - |
| Pairs per Column | - |
| Number of Signal Positions | - |
| PCB Retention Feature Material | - |
| Hybrid | No |
| Sealing Method | - |
| Contact Mating Area Plating Material Finish | Bright |
| Brand | TE Connectivity |
| Number of Columns | - |
| UL Rating | - |
| PCB Mount Orientation | Vertical |
| Product Type | Connector |
| Contact Mating Area Plating Thickness | 50 |
| Connector Style | - |
| Terminations per Post | - |
| Contact Underplating Material | - |
| Stackable | - |
| PCB Mount Retention Type | None |
| Stacking Configuration | - |
| Number of Contacts Loaded | - |
| Applied Pressure | - |
| UL File Number | - |
| Board-to-Board Configuration | Mezzanine |
| Number of Single Ended Lines | - |
| Approved Standards | - |
| Pick and Place Cover | With |
| Post Size | - |
| PCB Hole Shape | - |
| Data Rate | 10 |
| Voltage | 250 |
| Busbar Mating Area Plating Material | - |
| Height | - |
| Contact Resistance | - |
| Comment | - |
| Number of Rows | 8 |
| Termination Resistance | - |
| For Use With | - |
| Centerline (Pitch) | 1.27 |
| Termination Method to Printed Circuit Board | Surface Mount - Solder Ball |
| Hardware Type | - |
| Contact Shape | Square |
| Assembly Process Feature | Pick and Place Cover |
| Contact Configuration | - |
| Connector Seal Type | - |
| PCB Mount Alignment Type | None |
| MIL-C-55032 | Yes |
| Stack Height | .394 |
| Stabilizers | Without |
| Packaging Method | Pocket Tape |
| Flame Retardant | - |
| Keying Slot Location | - |
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