Contact Mating Area Plating Material | Gold over Copper |
Circuit Application | Signal |
Connector & Contact Terminates To | Wire & Cable |
Contact Type | Pin |
Wire Range | 24 – 20 |
Contact Base Material | Copper Alloy |
Contact Color Bands | - |
Two Wire Insulation Diameter | - |
Termination Method to Wire & Cable | Crimp |
Post Size | - |
Contact Retention in Housing | - |
Connector System | - |
Contact Current Rating (Max) | 7.5 |
TE Internal Number | 205089-4 |
Non-Magnetic | - |
Single Wire Insulation Diameter | - |
Pin Diameter | .041 |
Packaging Quantity | 1000 |
PCB Contact Termination Area Plating Material | - |
High Current | No |
Socket Hood Plating Material | - |
Comment | - |
For Use With | AMPLIMITE |
Contact Style | Crimp Snap-in |
End Node Category | D-Sub Connector Contacts |
PCB Termination Area Plating Finish | - |
Operating Temperature Range | -67 – 257 |
Color Code | No |
Wire Insulation Support | - |
Grade | - |
Insulation Diameter (Max) | 1.83 |
Socket Hood Finish | - |
Brand | AMP |
Solder Tail Contact Plating Thickness | - |
Contact Size | 20 |
Post Diameter | .039 – .041 |
Socket Hood Material | - |
Product Type | Contact |
Contact Underplating Material | - |
Contact Mating Area Plating Thickness | 50 |
Packaging Method | Bag |
Termination Post Length | .325 |
Accepts Wire Insulation Diameter Range | - |