| Number of Keys | 1 |
| Keying | Reverse |
| Center Post | - |
| Contact Mating Area Plating Material | Gold Flash |
| Socket Type | Memory Card |
| Circuit Application | Power |
| SGRAM Voltage | 1.5 |
| Housing Material | High Temperature Thermoplastic |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sealable | No |
| Contact Base Material | Copper Alloy |
| Module Key Type | SGRAM |
| Contact Current Rating (Max) | .5 |
| DRAM Type | Double Data Rate (DDR) 3 |
| Socket Style | SO DIMM |
| Packaging Quantity | 200 |
| PCB Contact Termination Area Plating Material | Gold |
| Connector Mounting Type | Board Mount |
| End Node Category | SO DIMM Sockets |
| PCB Mounting Style | Surface Mount |
| UL Flammability Rating | UL 94V-0 |
| Number of Bays | 2 |
| Retention Post Location | - |
| Brand | TE Connectivity |
| Insertion Style | Cam-In |
| Product Type | Socket |
| Contact Mating Area Plating Thickness | - |
| Contact Underplating Material | - |
| PCB Mount Retention Type | Solder Tail (Pin) |
| Latch Material | Stainless Steel |
| SGRAM Type | - |
| Module Orientation | Right Angle |
| Retention Post Material | - |
| Latch Plating Material | Tin |
| Ejector Location | Both Ends |
| Profile | Reverse |
| Connector System | Cable-to-Board |
| TE Internal Number | 2-2013287-1 |
| Comment | Without floating peg. |
| Number of Rows | 2 |
| DRAM Voltage | 1.5 |
| Number of Positions | 204 |
| Operating Temperature Range | -67 – 185 |
| Center Key | Offset Right |
| Centerline (Pitch) | .6 |
| PCB Mount Retention | With |
| Ejector Type | Locking |
| Stack Height | .157 |
| Housing Color | Black |
| Packaging Method | Emboss on Reel |
| Row-to-Row Spacing | .322 |
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