| Number of Keys | 1 |
| Center Post | Without |
| Contact Mating Area Plating Material | Tin |
| Circuit Application | - |
| Housing Material | Thermoplastic |
| Connector & Contact Terminates To | Printed Circuit Board |
| Sealable | - |
| Contact Base Material | Copper Alloy |
| Contact Current Rating (Max) | - |
| Boss | - |
| DRAM Type | Standard |
| Mating Alignment Type | Polarization |
| Packaging Quantity | 500 |
| PCB Contact Termination Area Plating Material | Gold Flash |
| Boardlock Plating Material Finish | - |
| Boardlock Material | - |
| Solder Tail Contact Plating Material Finish | - |
| End Node Category | Mini PCI Express & mSATA |
| PCB Mounting Style | Surface Mount |
| UL Flammability Rating | UL 94V-0 |
| High Temperature Housing | Yes |
| Brand | AMP |
| Insertion Style | Direct Insert |
| PCB Mount Orientation | - |
| Product Type | Connector |
| Contact Underplating Material | Nickel |
| Contact Mating Area Plating Thickness | - |
| Connector Style | Receptacle |
| Stackable | No |
| PCB Mount Retention Type | - |
| Latch Material | - |
| Module Orientation | Right Angle |
| Boardlock Plating Material | Tin |
| Latch Plating Material | - |
| Boardlock Type | - |
| Ejector Location | None |
| Connector System | - |
| TE Internal Number | 1717832-2 |
| Comment | - |
| Number of Rows | 2 |
| DRAM Voltage | 1.5 |
| Number of Positions | 52 |
| Operating Temperature Range | -55 – 85 |
| Center Key | None |
| Height Above PC Board | .157 |
| Centerline (Pitch) | .8 |
| PCB Mount Retention | Without |
| Bus Type | Mini PCI Express |
| Ejector Type | - |
| Stack Height | 4 |
| Housing Color | Black |
| Packaging Method | Tin |
| Row-to-Row Spacing | .8 |
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