Number of Keys | 1 |
Keying | Standard |
Center Post | - |
Contact Mating Area Plating Material | Gold Flash |
Socket Type | Memory Card |
Circuit Application | Power |
SGRAM Voltage | 2.5 |
Housing Material | High Temperature Thermoplastic |
Connector & Contact Terminates To | Printed Circuit Board |
Sealable | No |
Contact Base Material | Copper Alloy |
Module Key Type | SGRAM |
Contact Current Rating (Max) | .5 |
DRAM Type | Double Data Rate (DDR) |
Socket Style | SO DIMM |
Packaging Quantity | 20 |
PCB Contact Termination Area Plating Material | Gold Flash |
Connector Mounting Type | Board Mount |
End Node Category | SO DIMM Sockets |
PCB Mounting Style | Surface Mount |
UL Flammability Rating | UL 94V-0 |
Number of Bays | 2 |
Retention Post Location | - |
Brand | AMP |
Insertion Style | Cam-In |
Product Type | Socket |
Contact Mating Area Plating Thickness | - |
Contact Underplating Material | - |
PCB Mount Retention Type | Solder Peg |
Latch Material | Stainless Steel |
SGRAM Type | - |
Module Orientation | Right Angle |
Retention Post Material | - |
Latch Plating Material | Tin |
Ejector Location | Both Ends |
Profile | Standard |
Connector System | Cable-to-Board |
TE Internal Number | 1473005-1 |
Comment | - |
Number of Rows | 2 |
DRAM Voltage | 2.5 |
Number of Positions | 200 |
Operating Temperature Range | -55 – 85 |
Center Key | None |
Centerline (Pitch) | .024 |
PCB Mount Retention | With |
Ejector Type | Locking |
Stack Height | .205 |
Housing Color | Black |
Packaging Method | Semi-Hard Tray Assembly |
Row-to-Row Spacing | .244 |