Contact Mating Area Plating Material | Gold |
Circuit Application | Signal |
Heat Sink Finish | - |
Heat Sink Style | - |
Housing Material | LCP (Liquid Crystal Polymer) |
Connector & Contact Terminates To | Printed Circuit Board |
Sealable | - |
Contact Base Material | Phosphor Bronze |
Form Factor | XFP |
Connector System | Cable-to-Board |
Contact Current Rating (Max) | .5 |
TE Internal Number | 1367500-1 |
Number of Ports | - |
Data Rate (Max) | 10 |
Cage Material | - |
Included Heat Sink | - |
Connector Mounting Type | Board Mount |
Tail Length | - |
Heat Sink Height | - |
Comment | Lubricant on contact. |
Heat Sink Height Class | - |
Number of Positions | 30 |
插拔式 I/O 附件类型 | - |
End Node Category | XFP |
PCB Mounting Style | Double-Sided (Belly-to-Belly) |
Operating Temperature Range | -67 – 185 |
UL Flammability Rating | UL 94V-0 |
Centerline (Pitch) | .031 |
Material | - |
Termination Method to Printed Circuit Board | Surface Mount |
For Use With Pluggable I/O Products | - |
Brand | AMP |
Cage Plating Material | - |
Included Lightpipe | - |
Heat Sink Application | - |
Product Type | Connector |
Contact Mating Area Plating Thickness | .76 |
Connector Style | Receptacle |
Housing Color | White |
Packaging Method | Tape |
Port Matrix Configuration | - |
Product Line | XFP |
Cage Type | - |
Heat Sink Compatible | - |