Contact Mating Area Plating Material | Gold |
Circuit Application | Power & Signal |
Heat Sink Style | - |
Heat Sink Finish | - |
Connector & Contact Terminates To | Printed Circuit Board |
Integrated Lightpipes | - |
Sealable | No |
Form Factor | SFP |
Connector System | Cable-to-Board |
Contact Current Rating (Max) | .5 |
TE Internal Number | 1367073-2 |
Number of Ports | - |
Pluggable I/O Applications | SFP |
PCB Thickness (Recommended) | - |
Data Rate (Max) | 4 |
Cage Material | - |
Included Heat Sink | No |
Lightpipe Style | - |
Lightpipe Profile | - |
PCB Contact Termination Area Plating Material | - |
Connector Mounting Type | Board Mount |
Tail Length | - |
Tail Plating Material | - |
Heat Sink Height | - |
Comment | - |
Heat Sink Height Class | - |
插拔式 I/O 附件类型 | - |
Number of Positions | 20 |
Lightpipe Configuration | - |
End Node Category | SFP/SFP+/zSFP+ |
PCB Mounting Style | Surface Mount |
Operating Temperature Range | -55 – 85 |
UL Flammability Rating | UL 94V-0 |
Centerline (Pitch) | .031 |
Termination Method to Printed Circuit Board | Surface Mount |
For Use With Pluggable I/O Products | SFP Cage |
Brand | AMP |
Included Lightpipe | - |
Product Type | Connector |
Contact Mating Area Plating Thickness | .76 |
Contact Underplating Material | - |
Packaging Method | Reel |
Port Matrix Configuration | - |
Heat Sink Compatible | - |
EMI Containment Feature Type | - |
Cage Type | - |