Contact Mating Area Plating Material | Gold |
Blindmate | No |
Circuit Application | Signal |
Front Shell Plating Material | - |
Connector & Contact Terminates To | Printed Circuit Board |
Contact Type | Socket |
Sealable | No |
Contact Base Material | Brass or Beryllium Copper |
Connector System | Cable-to-Board |
Contact Current Rating (Max) | 5 |
Mounting Hole Diameter | .12 |
TE Internal Number | 1218435-1 |
Box Mount D-Sub Connector Insert Arrangement | MS18273-1 |
Non-Magnetic | No |
Front Shell Plating Finish | - |
PCB Contact Termination Area Plating Material | Nickel |
Preloaded | - |
Shell Plating Material | Cadmium |
Power/Signal/Coax Combination | No |
Front Shell Material | - |
Connector Mounting Type | - |
Rear Shell Plating Material | - |
Comment | For solder dip product see part number 1218435-6. |
Number of Positions | 9 |
Contact Style | Posted 90 |
End Node Category | Box Mount D-Sub Connectors |
PCB Termination Area Plating Finish | - |
Retention Clip Material | - |
Operating Temperature Range | -50 – 125 |
Centerline (Pitch) | .109 |
Shell Plating Finish | - |
ULTRA-LITE Connector | No |
Contact Mating Area Plating Material Finish | - |
Brand | AMP |
Contact Size | 20 |
Post Diameter | 1.02 |
PCB Mount Orientation | Right Angle |
Product Type | Connector |
Contact Mating Area Plating Thickness | 1.3 |
Connector Style | Receptacle |
Contact Underplating Material | - |
Packaging Method | Package |
Termination Post Length | .125 |
Shell Material | Steel |
Shell Size | 1 |
NASA Qualification | No |
Rear Shell Material | - |