1064538-1 规格参数
Contact Mating Area Plating Material | Gold |
Center Contact Plating | - |
Dielectric Material | Polypropylene |
Shield Material | Copper Wire |
Conductor Size | 30 |
Velocity of Propagation | - |
Conductor Plating | - |
Coupling Nut Material | - |
Connector Impedance | 50 |
Connector Type (End A) | SSMT Right Angle Jack |
Contact Base Material | Beryllium Copper |