| Contact Mating Area Plating Material | - |
| Circuit Application | Power & Signal |
| Socket Type | Discrete |
| Sleeve Material | Copper |
| Connector & Contact Terminates To | Printed Circuit Board |
| Contact Type | Socket |
| Sealable | No |
| Contact Base Material | Beryllium Copper |
| Profile | Zero |
| Termination Method to Wire & Cable | Solder |
| Connector System | Cable-to-Board |
| Sleeve Plating Material | Gold Flash over Nickel |
| Contact Current Rating (Max) | 6.5 |
| TE Internal Number | 1-331677-4 |
| Wire/Cable Type | Discrete Wire |
| Socket Length | 3.51 |
| Contact Spring Plating Thickness | .762 |
| PCB Thickness (Recommended) | .031 – .125 |
| Contact Spring Plating Material | Gold |
| Packaging Quantity | 2000 |
| Insertion Method | Hand/Semi-Automatic/Automatic |
| Wire/Cable Size | .41 – .518 |
| Mating Pin Diameter Range | .76 – .84 |
| Sealant | No |
| End Node Category | Discrete Sockets |
| Operating Temperature Range | -85 – 257 |
| Sleeve Style | Closed Bottom |
| Termination Method to Printed Circuit Board | Through Hole - Press-Fit |
| Brand | AMP |
| ワイヤ/ケーブルのサイズ | 20 – 21 |
| Spring Material | Beryllium Copper |
| Product Type | Contact |
| Contact Mating Area Plating Thickness | 30 |
| Packaging Method | Bag |
| Hole Size (Recommended) | 1.57 |
| Contact Transmits (Typical) | Signal (Data)/Power |
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