| Number of Channels per Chip | 4 |
| Minimum Common Mode Rejection (kV/us) | 35 |
| Minimum Isolation Voltage (Vrms) | 3750 |
| PCB changed | 16 |
| Output Type | Open Drain |
| ECCN (US) | EAR99 |
| Maximum Quiescent Supply Current (mA) | 11.6/7.7 |
| Maximum Power Dissipation (mW) | 275 |
| Maximum Data Rate | 10Mbps |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Maximum Pulse Width Distortion (ns) | 12 |
| Supplier Package | SOIC N |
| Maximum Output Current Drive (mA) | 10 |
| Package Height | 1.25(Min) |
| Maximum Operating Supply Voltage (V) | 5.5 |
| EU RoHS | Compliant |
| Maximum Working Insulation Voltage | 630Vp |
| Maximum Rise Time (ns) | 4 |
| Maximum Propagation Delay Time (tPHL) (ns) | 20 |
| Maximum Fall Time (ns) | 4 |
| Package Length | 9.9 |
| Standard Package Name | SOP |
| Pin Count | 16 |
| Mounting | Surface Mount |
| Type | I2C |
| Coupling Type | Capacitive Coupling |
| Lead Shape | Gull-wing |
| Part Status | Active |
| Minimum Pulse Width (ns) | 40 |
| Packaging | Tape and Reel |
| Maximum Propagation Delay Time (tPLH) (ns) | 20 |
| Package Width | 3.9 |
| Maximum Propagation Delay Skew (ns) | 20 |
| Minimum Operating Supply Voltage (V) | 3 |
