Number of Channels per Chip | 4 |
Minimum Common Mode Rejection (kV/us) | 35 |
Minimum Isolation Voltage (Vrms) | 3750 |
PCB changed | 16 |
HTS | 8542.39.00.01 |
Output Type | Open Drain |
ECCN (US) | EAR99 |
Maximum Quiescent Supply Current (mA) | 11.6/7.7 |
Maximum Power Dissipation (mW) | 275 |
Maximum Data Rate | 10Mbps |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
Maximum Pulse Width Distortion (ns) | 12 |
Supplier Package | SOIC N |
Maximum Output Current Drive (mA) | 10 |
Package Height | 1.25(Min) |
Maximum Operating Supply Voltage (V) | 5.5 |
EU RoHS | Compliant |
Maximum Working Insulation Voltage | 630Vp |
Maximum Rise Time (ns) | 4 |
Maximum Propagation Delay Time (tPHL) (ns) | 20 |
Maximum Fall Time (ns) | 4 |
Package Length | 9.9 |
Standard Package Name | SOP |
Pin Count | 16 |
Mounting | Surface Mount |
Type | General Purpose |
Coupling Type | Capacitive Coupling |
Lead Shape | Gull-wing |
Part Status | Active |
Minimum Pulse Width (ns) | 40 |
Packaging | Tube |
Maximum Propagation Delay Time (tPLH) (ns) | 20 |
Package Width | 3.9 |
Maximum Propagation Delay Skew (ns) | 20 |
Minimum Operating Supply Voltage (V) | 3 |