| Number of Channels per Chip | 1 |
| Power Supply Type | Single |
| PCB changed | 5 |
| Output Type | CMOS |
| Maximum Input Offset Voltage (mV) | 9@3V |
| Typical Output Current (mA) | 8@3V |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 530 |
| Maximum Input Offset Current (uA) | 0.000001(Typ)@3V |
| Minimum CMRR Range (dB) | <50 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Rail to Rail | Rail to Rail Input/Output |
| Supplier Package | HVSOF EP |
| Process Technology | CMOS |
| Typical Gain Bandwidth Product (MHz) | 4 |
| Typical Voltage Gain (dB) | 105 |
| Package Height | 0.55(Max) |
| Typical Input Bias Current (uA) | 0.000001@3V |
| EU RoHS | Compliant |
| Typical Single Supply Voltage (V) | 3|5 |
| Typical Slew Rate (V/us) | 3.4@3V |
| Package Length | 1.6 |
| Shut Down Support | No |
| Pin Count | 5 |
| Mounting | Surface Mount |
| Type | High Speed Amplifier |
| Minimum Single Supply Voltage (V) | 2.4 |
| Maximum Single Supply Voltage (V) | 5.5 |
| Minimum PSRR (dB) | 45 |
| Part Status | Active |
| Packaging | Tape and Reel |
| Manufacturer Type | High Speed Amplifier |
| Package Width | 1.2 |
| Minimum CMRR (dB) | 40 |
| Maximum Quiescent Current (mA) | 0.9@3V |
