Number of Channels per Chip | 1 |
Power Supply Type | Single |
PCB changed | 5 |
Output Type | CMOS |
Maximum Input Offset Voltage (mV) | 9.5@3V |
Typical Output Current (mA) | 2@3V |
ECCN (US) | EAR99 |
Maximum Power Dissipation (mW) | 530 |
Maximum Input Offset Current (uA) | 0.000001(Typ)@3V |
Minimum CMRR Range (dB) | <50 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 105 |
Rail to Rail | Rail to Rail Input/Output |
Supplier Package | HVSOF EP |
Process Technology | CMOS |
Typical Gain Bandwidth Product (MHz) | 0.0025 |
Typical Voltage Gain (dB) | 95 |
Package Height | 0.55(Max) |
Typical Input Bias Current (uA) | 0.000001@3V |
EU RoHS | Compliant |
Typical Single Supply Voltage (V) | 3|5 |
Typical Slew Rate (V/us) | 0.0025@3V |
Package Length | 1.6 |
Shut Down Support | No |
Pin Count | 5 |
Mounting | Surface Mount |
Type | Ultra Low Power Amplifier |
Minimum Single Supply Voltage (V) | 1.8 |
Maximum Single Supply Voltage (V) | 5.5 |
Minimum PSRR (dB) | 60 |
Part Status | Active |
Packaging | Tape and Reel |
Manufacturer Type | Ultra Low Power Amplifier |
Package Width | 1.2 |
Minimum CMRR (dB) | 45 |
Maximum Quiescent Current (mA) | 0.00095@3V |